I have a high-power chip at (0.5, 0.5) with intensity 2000 and radius 0.08. The chip runs extremely hot. Target: keep peak temperature below 0.5. Suggest heat spreader placements to meet this target.

3 heat sources in a line: (0.3, 0.5) intensity 800, (0.5, 0.5) intensity 1200, (0.7, 0.5) intensity 800, all radius 0.06. Target: peak temp below 0.8. Design a cooling layout.

4 power devices near the edges: (0.2, 0.2), (0.2, 0.8), (0.8, 0.2), (0.8, 0.8), each intensity 600 radius 0.05. Target: peak temp below 0.4. They're close to the cool boundaries — can we exploit that?

6 power devices in a 2x3 grid: (0.35,0.3), (0.35,0.5), (0.35,0.7), (0.65,0.3), (0.65,0.5), (0.65,0.7), each intensity 1000, radius 0.04. They're tightly packed and interact thermally. Target: peak temp below 0.6.

Two sources with very different intensities: (0.3, 0.5) at 2000 and (0.7, 0.5) at 200. Radius 0.07 each. Target: peak temp below 0.8. The design needs to handle the asymmetry.

Single intense source at dead center (0.5, 0.5), intensity 3000, radius 0.1. Target: peak temp below 0.15. This is extremely challenging — maximum heat spreader coverage needed.